View 290-1AB_206430.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

Board Level Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
217 SERIES
Surface Mount Heat Sinks
D 2PAK, TO-220, SOT-223, SOL-20
Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers' component thermal specifications.
FEATURES AND BENEFITS:
* No interface material is needed * Copper with tin-lead plating for improved solderability and assembly * Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for "Tape & Reel" and "Tube" formats * EIA standards and ESD protection are specified * Can be used with water soluble or no clean SMT solder creams or other pastes
Standard P/N
Height Above PC Board in. (mm)
Footprint Dimensions in. (mm) .600 (15.2) x .740 (18.8) .600 (15.2) x .740 (18.8) .600 (15.2) x .740 (18.8)
Package Format Bulk Tube Tape & Reel
Package Quantity 1 20 250
Thermal Performance at Typical Load Natural Forced Convection Convection) 55C @ 1W 55C @ 1W 55C @ 1W 16.0C/W @ 200 LFM 16.0C/W @ 200 LFM 16.0C/W @ 200 LFM
217-36CT6 .390 (9.9) 217-36CTT6 .390 (9.9) 217-36CTR6 .390 (9.9) Material: Copper, Tin, Lead Plated
MECHANICAL DIMENSIONS
217 HEAT SINK WITH DDPAK DEVICE
THERMAL PERFORMANCE 6 LAYER BOARD, D' PAK 125C LEAD, 40C AMBIENT
217-36CT6
Device Power Dissipation. W
KEY:
i Device only, NC
v Device + HS, NC
Device + HS, 100 lfm
Device + HS, 200 lfm
Device + HS, 300 lfm
SECTION A-A
NOTES 1. Material to be "ESD" 2. Approximately 6 Meters per Reel 3. 250 Pieces per Reel. 217-36CTR6
TAPE DETAILS
REEL DETAILS
Dimensions: in.
All other products, please contact factory for price, delivery, and minimums.
30
Normally stocked
Board Level Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
217 SERIES
Surface Mount Heat Sinks
D 2PAK, TO-220, SOL-20
MECHANICAL DIMENSIONS 217 SERIES
BOARD LAYOUT RECOMMENDATIONS
TUBE DETAILS
TUBE: 16.25 Inches Long, Min. ESDMaterial with Nail Stops 20 Pieces per Tube 217-36CTT6 SOL 20 REF: JEDEC TO-263 (DD PAK) REF: JEDEC MO-169 (DD PAK)
217-36CT6
Dimensions: in.
230 AND 234 SERIES
Compact, Wavesolderable Low-Profile Self-Locking Heat Sinks
Footprint Dimensions in. (mm) Mounting Configuation Vert./Horiz. Vertical Horizontal Vertical Vert./Horiz Vertical Horizontal Solderable Tab Option No Tab 01 05 10 No Tab 01 05
230-75AB-05
TO-220
Standard P/N
Height Above PC Board in. (mm)
Mounting Style Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole
Thermal Performance at Typical Load Natural Forced Convection Convection) 57C @ 2W 57C @ 2W 57C @ 2W 57C @ 2W 57C @ 2W 57C @ 2W 57C @ 2W 7.5C/W @ 400 LFM 7.5C/W @ 400 LFM 7.5C/W @ 400 LFM 7.5C/W @ 400 LFM 7.5C/W @ 400 LFM 7.5C/W @ 400 LFM 7.5C/W @ 400 LFM
PATENT PENDING
230-75AB .750 (19.1) .570 (14.5) x .500 (12.7) 230-75AB-01 .750 (19.1) .570 (14.5) x .500 (12.7) 230-75AB-05 .500 (12.7) .750 (19.1) x .570 (14.5) 230-75AB-10 .875 (22.2) .570 (14.5) x .500 (12.7) 234-75AB .790 (20.0) .570 (14.5) x .500 (12.7) 234-75AB-01 .790 (20.0) .570 (14.5) x .500 (12.7) 234-75AB-05 .500 (12.7) .790 (20.0) x .570 (14.5) Material: Aluminum, Black Anodized
230-75AB-01 230-75AB-10
MECHANICAL DIMENSIONS
230 AND 234 SERIES
230 SERIES
NATURAL AND FORCED CONVECTION CHARACTERISTICS
234 SERIES 234-75AB 234-75AB-01
234 SERIES
234-75AB-05
Dimensions: in. (mm)
Normally stocked
31
All other products, please contact factory for price, delivery, and minimums.
Board Level Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
233 AND 236 SERIES
Self-Locking Wavesolderable Heat Sinks
Footprint Dimensions in. (mm) Mounting Solderable Configuration Tab Options Vert./Horiz. Vertical Horizontal Vertical Vert./Horiz Vertical Horizontal Vetrical No Tab 01 05 10 No Tab 01 05 10 Mounting Style Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole
TO-220
Standard P/N
Height Above PC Board in. (mm)
Thermal Performance at Typical Load Natural Forced Convection Convection 58C @ 2W 58C @ 2W 58C @ 2W 58C @ 2W 58C @ 2W 58C @ 2W 58C @ 2W 58C @ 2W 11.0C/W @ 400 LFM 11.0C/W @ 400 LFM 11.0C/W @ 400 LFM 11.0C/W @ 400 LFM 4.80C/W @ 400 LFM 4.80C/W @ 400 LFM 4.80C/W @ 400 LFM 4.80C/W @ 400 LFM
PATENT PENDING
233-60AB .600 (15.2) .570 (14.5) x .500 (12.7) 233-60AB-01 .600 (15.2) .570 (14.5) x .500 (12.7) 233-60AB-05 .500 (12.7) .600 (15.2) x .570 (14.5) 233-60AB-10 .725 (18.4) .570 (14.5) x .500 (12.7) 236-150AB 1.500 (38.1) .570 (14.5) x .500 (12.7) 236-150AB-01 1.500 (38.1) .570 (14.5) x .500 (12.7) 236-150AB-05 .500 (12.7) 1.500 (38.1) x .570 (14.5) 236-150AB-10 1.625 (41.3) .570 (14.5) x .570 (12.7) Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS 233 AND 236 SERIES
NATURAL AND FORCED CONVECTION CHARACTERISTICS
233-60AB-01 236-150AB-01
233-60AB-10 236-150AB-10 233-60AB-05 236-150AB-05
236-150AB 233-60AB
Dimensions: in. (mm)
275 AND 231 SERIES
Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks
Footprint Dimensions in. (mm)
.835 (21.2) x .400 (12.7) .835 (21.2) x .400 (12.7) .835 (21.2) x .400 (14.5) .835 (21.2) x .400 (12.7) .690 (17.5) x .835 (12.7) .835 (21.2) x .400 (12.7) .835 (21.2) x .400 (14.5) .750 (19.1) x .835 (12.7) .835 (21.2) x .400 (12.7) .835 (21.2 x .400 (12.7) 1.375 (34.9) x .835 (12.7) .835 (21.2) x .400 (12.7)
TO-220
Standard P/N
Height Above PC Board in. (mm)
.750 (19.1) .750 (19.1) .875 (12.7) .690 (18.4) .400 (38.1) .690 (38.1) .750 (12.7) .400 (41.3) .750 (34.9) 1.375 (10.2) .400 (10.2) 1.375 (10.2)
Mounting Solderable Configuration Tab Options
Vert./Horiz. Vertical Vertical Vert./Horiz. Horizontal Vertical Vert./Horiz. Horizontal Vertical Vert./Horiz. Horizontal Vertical No Tab 01 10 No Tab 13H 13V, 14V, 15V No Tab 13H 13V, 14V, 15V No Tab 13H 13V, 14V, 15V
Mounting Style
Thermal Performance at Typical Load Natural Forced Convection Convection
44 C @ 2W 44C @ 2W 44C @ 2W 45C @ 2W 45C @ 2W 45C @ 2W 43C @ 2W 43C @ 2W 43C @ 2W 32C @ 2W 32C @ 2W 32C @ 2W 7.9C/W @ 400 LFM 7.9C/W @ 400 LFM 7.9C/W @ 400 LFM 8C/W @ 400 LFM 8C/W @ 400 LFM 8C/W @ 400 LFM 7.9C/W @ 400 LFM 7.9C/W @ 400 LFM 7.9C/W @ 400 LFM 5.9C/W @ 400 LFM 5.9C/W @ 400 LFM 5.9C/W @ 400 LFM
PATENT 5381041
275-75AB 275-75AB-01 275-75AB-10 231-69PAB 231-69PAB-13H 231-69PAB-XXX 231-75PAB 231-75PAB-13H (14V ) 231-75PAB-XXX 231-137PAB 231-137PAB-13H (15V ) 231-137PAB-XXX
Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole
Material: Aluminum, Pre-anodized Black (PAB), Anodized Black (AB)
MECHANICAL DIMENSIONS
275 AND 231 SERIES
NATURAL AND FORCED CONVECTION CHARACTERISTICS
TAB 13H
All versions No Tab
TAB 14V
TAB 13V
NATURAL AND FORCED CONVECTION CHARACTERISTICS
TAB 01 TAB 10 TAB 15V TAB 13H
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
32
Normally stocked
Board Level Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
235 SERIES
Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks
Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration Vert./Horiz. Vertical Horizontal Vertical Solderable Tab Options No Tab 01 05 10
235 SERIES
TO-220
Standard P/N
Mounting Style Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole
Thermal Performance at Typical Load Natural Forced Convection Convection 40C @ 2W 40C @ 2W 40C @ 2W 40C @ 2W 6.8C/W @ 400 LFM 6.8C/W @ 400 LFM 6.8C/W @ 400 LFM 6.8C/W @ 400 LFM
PATENT 5381041
235-85AB .850 (21.6) 1.000 (25.4) x .500 (12.7) 235-85AB-01 .850 (21.6) 1.000 (25.4) x .500 (12.7) 235-85AB-05 .500 (12.7) .850 (21.6) x1.000 (25.4) 235-85AB-10 .975 (24.8) 1.000 (25.4) x .500 (12.7) Material: Aluminum, Black Anodized
235-85AB
MECHANICAL DIMENSIONS
NATURAL AND FORCED CONVECTION CHARACTERISTICS
235-85AB-05 235-85AB-01 235-85AB-10
Dimensions: in. (mm)
243 SERIES
Labor-Saving Clip-On Heat Sinks
Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration Vert./Horiz. Verl./Horiz. Solderable Tab Options No Tab No Tab Mounting Style Clip Clip
TO-220
Standard P/N
Thermal Performance at Typical Load Natural Forced Convection Convection 50C@ 2W 78C@ 2W 4.5C/W @ 400 LFM 8.2C/W @ 400 LFM
243-1PAB 1.000 (25.4) .800 (20.3) x .270 (6.9) 243-3PAB .800 (20.3) .800 (20.3) x .270 (6.9) Material: Aluminum, Pre-anodized Black
MECHANICAL DIMENSIONS
243 SERIES
NATURAL AND FORCED CONVECTION CHARACTERISTICS
SECTION A-A
VIEW B-B
Dimensions: in. (mm)
239 SERIES
Snap-Down Self-Locking Heat Sinks
Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration Vert./Horiz Vertical Vertical Solderable Tab Options No Tab 03 04 Mounting Style Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole
TO-220
Standard P/N
Thermal Performance at Typical Load Natural Forced Convection Convection 38C @ 2W 38C @ 2W 38C @ 2W 6C/W @ 400 LFM 6C/W @ 400 LFM 6C/W @ 400 LFM
PATENT PENDING
239-75AB .750 (19.1) 1.120 (28.4) x .435 (11.0) 239-75AB-03 .750 (19.1) 1.120 (28.4) x .435 (11.0) 239-75AB-04 .750 (19.1) 1.120 (28.4) x .435 (11.0) Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
239-75AB
239 SERIES
SECTION A-A
NATURAL AND FORCED CONVECTION CHARACTERISTICS
239-75AB-03 239-75AB-04
Dimensions: in. (mm)
Normally stocked
33
All other products, please contact factory for price, delivery, and minimums.
Board Level Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
273 SERIES
Standard P/N
Low-Cost, Low-Height Wavesolderable Heat Sinks
Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration Vert./Horiz. Vertical Vertical Solderable Tab Options No Tab 01 02 Mounting Style Mtg Hole Mtg Hole Mtg Hole
TO-218, TO-220
Thermal Performance at Typical Load Natural Forced Convection Convection 49C @ 2W 49C @ 2W 49C @ 2W 7.2C/W @ 400 LFM 7.2C/W @ 400 LFM 7.2C/W @ 400 LFM
273-AB .375 (9.5) .750 (19.1) x .750 (19.1) 273-AB-01 .375 (9.5) .750 (19.1) x .750 (19.1) 273-AB-02 .375 (9.5) .750 (19.1) x .750 (19.1) Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
273 SERIES
NATURAL AND FORCED CONVECTION CHARACTERISTICS
273-AB 273-AB-01 273-AB-02
Dimensions: in. (mm)
274 SERIES
Standard P/N 274-1AB 274-1AB-01 274-1AB-02 274-2AB 274-2AB-01 274-2AB-02 274-3AB 274-3AB-01 274-3AB-02 281-1AB 281-2AB
Low-Cost, Low-Height Wavesolderable Heat Sinks
Height Above PC Board in. (mm) .375 (9.5) .375 (9.5) .375 (9.5) .500 (12.7) .500 (12.7) .500 (12.7) .250 (6.4) .250 (6.4) .250 (6.4) .375 (9.5) .500 (12.7) Footprint Dimensions in. (mm) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1)
274 SERIES
274-XAB-01 274-XAB-02
TO-220
Material: Aluminum, Black Anodized
Mounting Configuration Vert./Horiz. Vertical Vertical Vert./Horiz. Vertical Vertical Vert./Horiz. Vertical Vertical Vertical Vertical
Solderable Tab Options No Tab 01 02 No Tab 01 02 No Tab 01 02 No Tab No Tab
Mounting Style Mtg Hole Mtg Hole Mtg Hole Mtg Hole Mtg Hole Mtg Hole Mtg Hole Mtg Hole Mtg Hole Mtg Hole Mtg Hole
Thermal Performance at Typical Load Natural Forced Convection Convection 56C @ 2W 8.0C/W @ 400 LFM 56C @ 2W 8.0C/W @ 400 LFM 56C @ 2W 8.0C/W @ 400 LFM 50C @ 2W 7.0C/W @ 400 LFM 50C @ 2W 7.0C/W @ 400 LFM 50C @ 2W 7.0C/W @ 400 LFM 62C @ 2W 9.0C/W @ 400 LFM 62C @ 2W 9.0C/W @ 400 LFM 62C @ 2W 9.0C/W @ 400 LFM 56C @ 2W 8.0C/W @ 400 LFM 50C @ 2W 7.0C/W @ 400 LFM
NATURAL AND FORCED CONVECTION CHARACTERISTICS
MECHANICAL DIMENSIONS
274 SERIES
281 SERIES
Dimensions: in. (mm)
240 SERIES
Standard P/N
Labor-Saving Twisted Fin Heat Sinks
Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration Vertical Vertical Solderable Tab Options 22 22 Mounting Style Clip/Mtg Hole Clip/Mtg Slot
TO-220
Thermal Performance at Typical Load Natural Forced Convection Convection 55C @ 4W 55C @ 4W 5.3C/W @ 400 LFM 5.3C/W @ 400 LFM
240-118ABH-22 1.180 (30.0) 1.000 (25.4) x .500 (12.7) 240-118ABS-22 1.180 (30.0) 1.000 (25.4) x .500 (12.7) Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
240 SERIES
NATURAL AND FORCED CONVECTION CHARACTERISTICS
240-118ABS-22
240-118ABH-22
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
34
Normally stocked
Board Level Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
242 SERIES
Low-Height, Low-Profile Twisted Fin Heat Sinks
Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration Vertical Solderable Tab Options 22 Mounting Style Mtg Hole
TO-220
Standard P/N
Thermal Performance at Typical Load Natural Forced Convection Convection 48C @ 2W 6.2C/W @ 400 LFM
242-125AB-22 1.285 (32.6) .875 (22.2) x .250 (6.4) Material: Aluminum, Black Anodized
242-125AB-22
MECHANICAL DIMENSIONS
242 SERIES
NATURAL AND FORCED CONVECTION CHARACTERISTICS
Dimensions: in. (mm)
232 AND 238 SERIES
Staggered Fin Heat Sinks for Vertical Mounting
Footprint Dimensions in. (mm) 1.380 (35.1) x .500 (12.7) 1.380 (35.1) x .500 (12.7) 1.380 (35.1) x .500 (12.7) 1.380 (35.1) x .500 (12.7)
238-200AB
TO-202, TO-220
Standard P/N 232-200AB 232-200AB-23 238-200AB 238-200AB-23
Height Above PC Board in. (mm) 2.000 (50.8) 2.000 (50.8) 2.000 (50.8) 2.000 (50.8)
Mounting Configuration Vertical Vertical Verlical Verlical
238-200AB-23
Solderable Tab Options 2, Twisted 2, Solderable 2, Twisted 2, Solderable
Mounting Style Clip/Mtg Hole Clip/Mtg Hole Mtg Slot Mtg Slot
Thermal Performance at Typical Load Natural Forced Convection Convection 48C @ 4W 48C @ 4W 48C @ 4W 48C @ 4W 3.3C/W @ 400 LFM 3.3C/W @ 400 LFM 3.3C/W @ 400 LFM 3.3C/W @ 400 LFM
Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
232-200AB 232-200AB-23
238 SERIES
232 AND 238 SERIES
NATURAL AND FORCED CONVECTION CHARACTERISTICS
Dimensions: in. (mm)
251 SERIES
Slim-Profile Heat Sinks With Integral Clips
Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration Vert./Horiz. Vert./Horiz. Vertical Solderable Tab Options No Tab No Tab 19 Mounting Style Clip Clip Clip
15 Lead Multiwatt
Standard P/N
Thermal Performance at Typical Load Natural Forced Convection Convection 66C @ 3W 64C @ 3W 64C @ 3W 66C/W @ 400 LFM 66C/W @ 400 LFM 66C/W @ 400 LFM
251-62AB .620 (15.7) .910 (23.1) x .380 (9.7) 251-80AB .845 (21.5) .910 (23.1) x .380 (9.7) 251-80AB-19 .875 (22.2) .910 (23.1) x .380 (9.7) Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
251 SERIES
NATURAL AND FORCED CONVECTION CHARACTERISTICS
251-62AB
251-80AB
251-80AB-19
Dimensions: in. (mm)
Normally stocked
35
All other products, please contact factory for price, delivery, and minimums.
Board Level Heat Sinks
BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND MULTIWATTTM COMPONENTS
244 SERIES
Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks
Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration Vert/Horiz, Vertical Solderable Tab Options No Tab 50 Thermal Performance at Typical Load Natural Forced Convection Convection 44C @ 4W 44C @ 4W 4.4C/W @ 400 LFM 4.4C/W @ 400 LFM
MULTIWATT
Standard P/N
Weight lbs. (grams) .0160 (7.25) .0170 (7.20)
244-145AB 1.450 (36.8) 1.300 (33.0) x 480 (12.1) 244-145AB-50 1.650 (41.9) 1.300 (33.0) x 480 (12.1) Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
245 SERIES
Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks
Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration Ver.t/Horiz. Vertical Solderable Tab Options No Tab 50 Thermal Performance at Typical Load Natural Forced Convection Convection 38C @ 4W 38C @ 4W 3.2C/W @ 400 LFM 3.2C/W @ 400 LFM
MULTIWATT
Standard P/N
Weight lbs. (grams) .0160 (7.25) .0170 (7.20)
245-145AB 1.450 (36.8) 1.750 (44.5) x .380 (9.7) 245-145AB-50 1.650 (41.9) 1.750 (44.5) x .380 (9.7) Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
246 SERIES
Medium Height, Slim Profile Wavesolderable Folded Fin Heat Sinks
Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration Solderable Tab Options No Tab 50 Thermal Performance at Typical Load Natural Forced Convection Convection 35C @ 4W 35C @ 4W 2.8C/W @ 400 LFM 2.8C/W @ 400 LFM
MULTIWATT
Standard P/N
Weight lbs. (grams) .0240 (10.90) .0250 (11.40)
246-197AB 1.968 (50.0) 1.986 (50.4) x 3.75 (9.5) Vert./Horiz. 246-197AB-50 2.168 (55.1) 1.986 (50.4) x 3.75 (9.5) Vertical Order SpeedClipTM 285SC or 330SC separately. (See 248 Series section). Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
36
Normally stocked
Board Level Heat Sinks
BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND MULTIWATTTM COMPONENTS
247 SERIES
Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks
Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration Solderable Tab Options No Tab 50 Thermal Performance at Typical Load Natural Forced Convection Convection 25C@ 4W 25C@ 4W 2.4C/W @ 400 LFM 2.4C/W @ 400 LFM
MULTIWATT
Standard P/N
Weight lbs. (grams) .0330 (15.10) .0340 (15.60)
247-195AB 1.950 (49.5) 1.900 (48.3) x .950 (24.1) Vert./Horiz. 247-195AB-50 1.950 (49.5) 1.900 (48.3) x .950 (24.1) Vertical Order SpeedClipTM 285SC or 330SC separately. (See 248 Series section). Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
248 SERIES
Low Height, Medium Profile Wavesolderable Folded Fin Heat Sinks
Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration Vert/Horiz. Vertical Solderable Tab Options No Tab 50 Thermal Performance at Typical Load Natural Forced Convection Convection 35C @ 4w 35C @ 4w 2.5C/W @ 400 LFM 2.5C/W @ 400 LFM
MULTIWATT
Standard P/N
Weight lbs. (grams) .026 (11.60) .027 (12.20)
248-162AB 1.620 (41.1) 2.000 (50.8) x .750 (19.1) 248-162AB-50 1.620 (41.1) 2.000 (50.8) x .750 (19.1) Order SpeedClipTM 285SC or 330SC separately. Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
Order SpeedClipsTM separatley for use with Series 246, 247, 248 or 249
Dimensions: in. (mm)
249 SERIES
Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks
Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration Solderable Tab Options No Tab 50 Thermal Performance at Typical Load Natural Forced Convection Convection 35C@ 4W 35C@ 4W 3.29C/W @ 400 LFM 3.29C/W @ 400 LFM
MULTIWATT
Standard P/N
Weight lbs. (grams) .020 (8.90) .021 (9.40)
249-113AB 1.130 (28.7) 1.900 (48.3) x .950 (24.1) Vert./Horiz, 249-113AB-50 1.130 (28.7) 1.900 (48.3) x .950 (24.1) Vertical Order SpeedClipTM 285SC or 330SC separately. (See 248 Series section). Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
Normally stocked
37
All other products, please contact factory for price, delivery, and minimums.
Board Level Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
288 SERIES
Compact Wave-Solderable Low-Cost Heat Sinks
Height Above PC Board in. (mm) 1.250 (31.8) Maximum Footprint in. (mm) 0.875 (22.2) x 0.215 (5.5) Thermal Performance at Typical Load Natural Forced Convection Convection 85C @ 4W 12C/W @ 200 LFM
TO-220, TO-202
Standard P/N 288-1AB
Weight lbs. (grams) 0.0057 (2.59)
Mounting tabs are pre-tinned to ensure excellent wave-solder bond and good electrical connections for vertical mounting of TO-220 and TO-202 semiconductor packages. These heat sinks are designed for use where minimum PC
board space is available. The 288-1AB is a stamped aluminum heat sink, black anodized, designed for applications requiring good heat dissipation from a heat sink occupying minimum space, available at minimum cost. NATURAL AND FORCED CONVECTION CHARACTERISTICS
MECHANICAL DIMENSIONS
288 SERIES
Dimensions: in. (mm)
271 SERIES
Top-Mount Booster Heat Sinks for Use with 270/272/280 Series
Height Above Semiconductor Case in. (mm) 0.500 (12.7) Horizontal Mounting Footprint Dimensions in. (mm) 1.750 (44.5) x 0.700 (17.8) Thermal Performance at Typical Load Natural Forced Convection Convection 62C @ 4W (NOTE A) 31 C @ 4W (NOTE B) 5.1C/W @ 400 LFM 1.8C/W 400 LFM (NOTE B)
TO-220
Standard P/N 271-AB
Weight lbs. (grams) 0.0052 (2.36)
Material: Aluminum, Black Anodized
This top-hat style booster heat sink can be added to any of the 270, 272, or 280 Series for improved performance. NOTE A: Thermal resistance with one 271-AB. NOTE B: Thermal resistance (total) as shown with (2) 271-AB types added to (1) 272-AB type.
MECHANICAL DIMENSIONS
271 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
38
Normally stocked
Board Level Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
270/272/280 SERIES
Small Footprint Low-Cost Heat Sinks
Horizontal Mounting Maximum Footing in. (mm) Solderable Tab Options -- 01,02 -- Thermal Performance at Typical Load Natural Forced Convection Convection 70C @ 4W 42C @ 4W 70C @ 4W 6.0C/W @ 400 LFM 3.6C/W @ 400 LFM 6.0C/W @ 400 LFM
TO-220, TO-202
Standard P/N
Height Above PC Board in. (mm)
Weight lbs. (grams) 0.0052 (2.36) 0.0105 (5.72) 0.0048 (2.18)
270-AB 0.375 (9.4) 1.750 (44.5) x 0.700 (17.8) 272-AB 0.375 (9.4) 1.750 (44.5) x 1.450 (36.8) 280-AB 0.375 (9.4) 1.750 (44.5) x 0.700 (17.8) Material: Aluminum, Black Anodized
These exceptionally low-cost heat sinks can be mounted horizontally under a TO-220 or TO-202 case style with a maximum height of only 0.375 in. (9.4). For added performance, a 271 Series heat sink can also be used for double-sided heat dissi-
pation. The 270-AB and 280-AB accept one power semiconductor; the 272-AB is designed for two power semiconductors. Specify solderable tab options for the 272 Series by the addition of suffix "O1" or "02" to the standard part number (i.e. 272-AB01 or 272-AB02). NATURAL AND FORCED CONVECTION CHARACTERISTICS
MECHANICAL DIMENSIONS
270 SERIES
280 SERIES
272 SERIES
272AB01
272AB02
Dimensions: in. (mm)
289 AND 290 SERIES
Low-Cost Single or Dual Package Heat Sinks
Height Above PC Board in. (mm) Horizontal Mounting Maximum Footing in. (mm) 1.000 (25.4) x O.710 (18.1) 1.000 (25.4) x 0.710 (18.1) 1.000 (25.4) x 1.180 (30.0) 1.000 (25.4) x 1.180 (30.0) Thermal Performance at Typical Load Natural Forced Convection Convection 50C @ 2W 50C @ 2W 44C @ 2W 44C @ 2W
TO-218, TO-202, TO-220
Standard P/N
Weight lbs. (grams) 0.0055 (2.49) 0.0055 (2.49) 0.0082 (3.72) 0.0081 (3.67)
289-AB 0.500 (12.7) 289-AP 0.500 (12.7) 290-1AB 0.500 (12.7) 290-2AB 0.500 (12.7) Material: Aluminum, Black Anodized
44C/W @ 400 LFM 44C/W @ 400 LFM 35C/W @ 400 LFM 35C/W @ 400 LFM
Low in cost and compact in overall dimensions, one 289 Series heat sink can accommodate one semiconductor; the 289 Series is available with a black anodized finish (289-AB) or with 289 SERIES
no finish (289-AP). Two semiconductors can be mounted to the 290-2AB style.
MECHANICAL DIMENSIONS
290 SERIES
NATURAL AND FORCED CONVECTION CHARACTERISTICS
Dimensions: in. (mm)
Normally stocked
39
All other products, please contact factory for price, delivery, and minimums.
Board Level Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
250 SERIES
Standard P/N
High-Performance Slim Profile Heat Sinks With Integral Clips
Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration Vert./Horiz. Vertical Vertical
250-122AB-09
Multiwatt Mounting Style Clip Clip Clip Thermal Performance at Typical Load Natural Forced Convection Convection 50C @ 4W 50C @ 4W 50C @ 4W 3.7C/W @ 400 LFM 3.7C/W @ 400 LFM 3.7C/W @ 400 LFM
Solderable Tab Options No Tab 09 25
250-122AB-25
250-122AB 1.220 (31.0) 1.000 (25.4) x .500 (12.7) 250-122AB-09 1.220 (31.0) 1.000 (25.4) x .500 (12.7) 250-122AB-25 1.380 (35.1) 1.000 (25.4) x .500 (12.7) Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
250 SERIES
NATURAL AND FORCED CONVECTION CHARACTERISTICS
250-122AB
Dimensions: in. (mm)
237 AND 252 SERIES
Standard P/N
High-Performance, High-Power Vertical Mount Heat Sinks
Footprint Dimensions in. (mm) Mounting Configuration Solderable Tab Options Mounting Style
TO-220 Thermal Performance at Typical Load Natural Forced Convection Convection
Height Above PC Board in. (mm)
237-167AB2 1.675 (42.5) 1.000 (25-4) x 1.000 (25.4) Vertical 2, Twisted Clip/Mtg Slot 46 C @ 4W 4.5 C/W @ 200 LFM 237-167AB3 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 3, Twisted Clip/Mtg Slot 46 C @ 4W 4.5 C/W @ 200 LFM 237-167AB2-24 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 2, Solderable Clip/Mtg Slot 46 C @ 4W 4.5 C/W @ 200 LFM 252-167AB2 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 2, Twisted Clip/Mtg Slot 40 C @ 4W 4.5 C/W @ 200 LFM 252-167AB3 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 3, Twisted Clip/Mtg Slot 40 C @ 4W 4.5 C/W @ 200 LFM 252-167AB2-24 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 2, Solderable Clip/Mtg Slot 40 C @ 4W 4.5 C/W @ 200 LFM Order SpeedClipsTM 285SC or 330SC separately for rapid component installation, lowering manufacturing costs. Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
237 AND 252 SERIES
227-167
252-167
237-167AB2 252-167AB2
237-167AB2-24 252-167AB2-24
NATURAL AND FORCED CONVECTION CHARACTERISTICS
237-167AB3
252-167AB3
237 AND 252 SERIES
237-167AB3 252-167AB3
Dimensions: in. (mm)
291 SERIES
Labor-Saving Clip-on Heat Sinks
Height Above PC Board in. (mm) Vertical Mounting Footprint Dimensions in. (mm) Thermal Performance at Typical Load Natural Forced Convection Convection 80 C @ 2W 68 C @ 2W 24C/W @ 600 LFM 16C/W @ 600 LFM
TO-220
Standard P/N
Mounting Style TO-220 (Clip) TO-220 (Mtg. Hole)
Weight lbs. (grams) 0.0026 (1.18) 0.0026 (1.18))
291-C236AB 0.860 (21.)9 1.100 (27.0) x 0.360 (9.1) 291-H36AB 0.860 (21.9) 1.100 (27.0) x 0.360 (9.1) Material: Aluminum, Black Anodized Designed for mounting horizontally or vertically on a circuit board, 291 Series heat sinks employ a unique clip for attachment of TO-220 case styles.
One type is available with a locking clip and one with a 0.140 in. (3.6) diameter mounting hole only. NATURAL AND FORCED CONVECTION CHARACTERISTICS
MECHANICAL DIMENSIONS
291 SERIES
Dimensions: in. (mm)
291-C2 291-H
All other products, please contact factory for price, delivery, and minimums.
40
Normally stocked
Board Level Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
286 SERIES
Aluminum and Copper Low-Cost Wave-Solderable Heat Sinks
Height Above PC Board in. (mm) 1.190 (30.2) 1.190 (30.2) 1.190 (30.2) Maximum Footprint in. (mm) 1.000 (25.4) x 0.500 (12.7) 1.000 (25.4) x 0.500 (12.7) 1.000 (25.4) x 0.500 (12.7) Thermal Performance at Typical Load Natural Forced Convection Convection 58C @ 4W 58C @ 4W 58C @ 4W 7.4CW @ 200 LFM 7.4CW @ 200 LFM 7.4CW @ 200 LFM
TO-220
Standard P/N 286-AB 286-CBT 286-CT
Material Aluminum, Anodized Copper, Black Copper, Tinned
Weight lbs. (grams) 0.0085 (3.86) 0.0250 (11.34) 0.0250 (11.34)
Efficient heat removal at low cost can be achieved by inserting the 286 Series directly into predrilled circuit boards; scored mounting tabs may be bent after insertion to provide added stabili-
ty. The 286 Series can be wavesoldered directly to the board. Material: 286-AB style (aluminum, black anodized), 286-CBT style (copper, black paint tin tabs), and 286-CT style (copper, tinned). NATURAL AND FORCED CONVECTION CHARACTERISTICS
MECHANICAL DIMENSIONS
286 SERIES
Dimensions: in. (mm)
287 SERIES
Wave-Solderable Low-Cost Heat Sinks
Height Above PC Board in. (mm) Maximum Footprint "A" in. (mm) 1.000 (25.4) x 0.500 (12.7) 1.000 (25.4) x 1.000 (25.4) Thermal Performance at Typical Load Natural Forced Convection Convection 65C @ 4W 5510 @ 4W 7.8CW @ 200 LFM 6.4CW @ 200 LFM
TO-220
Standard P/N Mounting Slot Mounting Hole
Weight lbs. (grams) 0.0090 (4.08) 0.0140 (6.35)
287-1AB 287-1ABH 1.180 (30.0) 287-2AB 287-2ABH 1.180 (30.0) Material: Aluminum, Black Anodized
Mount these cost-effective TO-220 heat sinks vertically into pre-drilled printed circuit boards. Soldered, pre-tinned tabs can be wavesoldered directly to the board. A 0.375 in. (9.5 mm)
mounting slot allows for correct positioning of TO-220 and similar semiconductor packages.
MECHANICAL DIMENSIONS
287 SERIES
NATURAL AND FORCED CONVECTION CHARACTERISTICS
Dim. "A"
0.500 (12.7) 1.000 (25.4) 0.500 (12.7) 1.000 (25.4)
Standard P/N
287-1AB 287-2AB 287-1ABH 287-2ABH
Dimensions: in. (mm)
695 SERIES
Space-Saving Heat Sinks for Small Stud-Mounted Diodes
Maximum Width in. (mm) 1.330 (33.8) Height in. (mm) 0.530 (13.7) Thermal Performance at Typical Load Natural Forced Convection Convection 72C @ 4.0W 5.2C/W @ 400 LFM
STUD-MOUNT
Standard P/N 695-1B
Weight lbs. (grams) 0.0030 (1.36)
Mount and effectively heat sink small stud-mounted diodes with the 695 Series space-saving heat sink type. Each unit is black anodized aluminum with an 0.200 in. (5.1) dia. mounting hole centered in the base. The folded fin design
provides good heat dissipation for use where height is limited above the printed circuit board or base plate. NATURAL AND FORCED CONVECTION CHARACTERISTICS
MECHANICAL DIMENSIONS
695 SERIES
Dimensions: in. (mm)
Normally stocked
41
All other products, please contact factory for price, delivery, and minimums.
Board Level Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
256 SERIES
Thermal Retainers
Height (Less Mounting Tab) in. (mm) 0.190 (4.0) Weight lbs. (grams) 0.0005 (0.23)
256-DM
TO-92
Standard P/N 256-DM
Material Beryllium Copper
260 SERIES
Cup Clips for TO-5 Case Style Semiconductors
Depth of Tapped Base 0.093 (2.36) 0.125 (3.18) 0.125 (3.18)
= = = = = = #4-40 UNC #6-32 UNC #10-32 UNF tapped stud plain Base Style: Semiconductor Case Style: Insulation Type: H = hex 5 = TO-5 E = epoxy B = beryllium
TO-5
Characteristics Thermal Resistance - Epoxy Insulated Thermal Resistance - Beryllium Oxide Insulated Breakdown Voltage - Epoxy Type (VAC), 60 Hz Breakdown Voltage - Beryllium Type (VAC), 60 Hz Recommended Operating Voltage, AC or DC Clean Conditions: % Hipot Rating Dusty Conditions: % Hipot Rating Dirty Conditions: % Hipot Rating Temperature Range -- Continuous (C)
TO-5 14 C/W 16 C/W 500 1000 50 30 10 to 20 -73/+149
Model 260-4T5E 260-4TH5E 260-4TH5B
Thread Size: Mounting Style: 4 6 10 T S P
TO-5 CASE STYLE CUP CLIPS -- ORDERING GUIDE
Standard P/N 260-4T5E 260-4TH5E 260-6SH5E 260-1OSH5E 260-4TH5B 260-6SH5B 260-10SH5B Insulation Type Epoxy Insulated Epoxy Insulatad Epoxy Insulated Epoxy Insulated Beryllium Oxide Insulated Beryllium Oxide Insulated Beryllium Oxide Insulated Outline Dimension L x W x I.D. in. (mm) 0.370 (9.4) x 0.380 (9.7) dia. x 0.290 (7.4) 0.400 (10.2) x 0.370 (9.4) hex. x 0.290 (7.4) 0.557 (14.1) x 0.370 (9.4) hex. x 0.290 (7.4) 0.557 (14.1) x 0.370 (9.4) hex. x 0.290 (7.4) 0.445 (11.3) x 0.370 (9.4) hex. x 0.290 (7.4) 0.607 (15.4) x 0.370 (9.4) hex. x 0.290 (7.4) 0.607 (15.4) x 0.370 (9.4) hex. x 0.290 (7.4) Weight lbs. (grams) 0.0024 (1.09) 0.0031 (1.41) 0.0037 (1.68) 0.0042 (1.91) 0.0042 (1.91) 0.0039 (1.77) 0.0043 (1.95) Case Style TO-5 TO-5 TO-5 TO-5 TO-5 TO-5 TO-5
Materials and Finish: Cups - beryllium copper, black ebonol "C"; Bases - brass, black ebonol "C"; Ceramic Spacers - beryllium oxide
Base Mounting Configurations -- TO-5 Plain Type -- Epoxy bonded, or used with #4 pan head screws. Tapped Base -- #4-40 UNC screw (not supplied) fits tapped hole. Care should be taken not to use too long a screw, which could short against the semiconductor case. For correct screw lengths:
Correct Screw Length (L) = Depth of Base + Panel Thickness + Washer Thickness
Stud Mounting Base. #6-32 UNC or #10-32 UNF studs. Nuts and washers not supplied. Stud hole must be slightly countersunk to ensure flat mounting.
To determine the correct mounting screw lengths, add dimensions as follows: Correct Screw Length (L) = Depth of Base + Panel Thickness + Washer Thickness
Epoxy Insulated For TO-5
Beryllium Oxide Insulated For TO-5
260-4T5E
260-4TH5E 260-6SH5E 260-10SH5E
260-4TH5B 260-6SH5B 260-10SH5B
Normally stocked
All other products, please contact factory for price, delivery, and minimums.
42
Board Level Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
200 SERIES
High-Efficiency Heat Sinks for Small Metal Can Power Semiconductors
Single-Level Star 201, 202,204,205, 211 Series
Dual-Level Star 203,207,213 Series
Dual-Level Sunburst 209, 215 Series
Available Standard P/N & Finish Types 201CB, 201AB 202CB 203CB 204CB , 204SB 205CB , 205SB 205AB, 205AP 207CB , 207SB 207AB , 207AP 209CB, 209SB 211CB 213CB, 213SB 213AB, 213AP 215CB, 215AB 215AP
Semiconductor Case Diameter Min/Max in. (mm) 0.161 (4.1)/0.240 (6.1) 0.161 (4.1)/0.240 (6.1) 0.161 (4.1)/0.240 (6.1) 0.275 (7.0)/0.370 (9.4) 0.275 (7.0)/0.370 (9.4) 0,275 (7.0)/0.370 (9.4) 0.275 (7.0)/0.370 (9.4) 0.275 (7.0)/0.370 (9.4) 0.275 (7.0)/0.370 (9.4) 0.440 (11.2)/0.544 (13.8) 0.440 (11.2)/0.544 (13.8) 0.440 (11.2)/0.544 (13.8) 0.440 (11.2)/0.544 (13.8) 0.440 (11.2)/0.544 (13.8)
Heat Sink Inside Dia. "A" in. (mm) 0.150 (3.8) 0.150 (3.8) 0.150 (3.8) 0.255 (6.5) 0.255 (6.5) 0.255 (6.5) 0.255 (6,5) 0.255 (6.5) 0.255 (6.5) 0.420 (10.7) 0.420 (10.7) 0.420 (10.7) 0.420 (10.7) 0.420 (10.7)
Heat Sink Outside Dia. "B" in. (mm) 0.640 (16.2) 0.490 (12.5) 0.640 (16.2) 0.550 (4.8) 0.720 (18.3) 0.720 (18.3) 0.720 (18.3) 0.720 (18.3) 1.280 (32.5) 0.830 (21.1) 0.830 (21.1) 0.830 (21.1) 1.400 (35.6) 1.400 (35.6)
Heat Sink Height "C" in. (mm) 0.187 (4.8) 0.187 (4.8) 0.375 (9.5) 0.187 (4.8) 0.187 (4.8) 0.187 (4.8) 0.375 (9.5) 0.375 (9.5) 0.437 (11.1) 0.187 (4.8) 0.375 (9.5) 0.375 (9.5) 0.437 (11.1) 0.437 (11.1)
Natural Convection Forced Case Rise Convection Above Ambient (CA@200 LFM) 65C @ 1W 73C @ 1W 53C @ 1W 68C @ 1W 59C @ 1W 68C @ 1W 46C @ 1W 53C @ 1W 30C @ 1W 50C @ 1W 44C @ 1W 51C @ 1W 28C @ 1W 32C @ 1W 31C/W 43C/W 23C/W 35C/W 28C/W 28C/W 20C/W 20C/W 13C/W 24C/W 19C/W 19C/W 15C/W 15C/W
Applicable Power Semiconductor Case Types TO-18, TO-24, TO-28, TO-40, TO-44 TO-5, TO-9, TO-11, TO-12, TO-26, TO-29, TO-33, TO-43, TO-45
Materials and Finishes Available for 200 Series:
CB Beryllium copper; black ebonol "C" Finish Silver-bearing copper; black ebonol "C" Aluminum, black anodized Aluminum, no finish applied
SB
AB AP TO-8, TO-38
NATURAL AND FORCED CONVECTION CHARACTERISTICS
258 SERIES
Standard P/N 258
Thermal Links for Fused Glass Diodes
Dimensions in. (mm) 0.500 (12.7) x 0.250 (6.4) x 0.340 (8.6) Material Aluminum Finish DeltaCoateTM 151 on all surfaces except solder pads and base
DIODES
Weight lbs. (grams) 0.0018 (0.82)
MECHANICAL DIMENSIONS
The thermal resistance from diode leads to chassis or heat sink is 12C/watt, when unit is mounted with TYPE 120 Joint Compound. If a 10C/watt chassis or sink to ambient impedance is available, the thermal resistance from the diode leads to ambient is reduced from about 150C/watt to 22C/watt. 258 SERIES
Dimensions: in. (mm)
292 SERIES
Standard P/N
292-AB
Heat Sink for Single TO-92
Height Above PC Board in. (mm)
0.750 (19.1)
TO-92
Overall Fin Width in. (mm)
0. 600 (15.3)
Thermal Performance Natural Convection
0.225 C/W @ 0.250 W 292 SERIES
Finish
Black Anodized
Weight lbs. (grams)
0.00049 (0.22)
Power semiconductors packaged in a TO-92 style plastic case can be cooled effectively at little additional cost with the addition of the 292-AB heat sink. The 292-AB is effective over the typical power range of such devices. Material: Aluminum, Black Anodized.
MECHANICAL DIMENSIONS
NATURAL AND FORCED CONVECTION CHARACTERISTICS
Dimensions: in. (mm)
Normally stocked
43
All other products, please contact factory for price, delivery, and minimums.
Board Level Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
634 SERIES
Slim Profile Unidirectional Fin Vertical Mount Heat Sink
Height Above PC Board in. (mm) 1.000 (25.4) 1.500 (38.1) 2.000 (50.8) Footprint Dimensions in. (mm) 0.640 (16.26) x 0.640 (16.26) 0.640 (16.26) x 0.640 (16.26) 0.640 (16.26) x 0.640 (16.26)
TO-220 and TO-218
Standard P/N Plain Pin Without Pin 634-10ABP 634-10AB 634-15ABP 634-15AB 634-20ABP 634-20AB Material: Aluminum, Black Anodized.
Weight lbs. (grams) 0.016 (7.48) 0.025 (11.21) 0.033 (14.95)
These slim profile unidirectional fin heat sinks offer users two assembly alternatives for vertically mounting TO-220 and TO-218 components. Models are available with or without wave-
solderable pins on 0.40 in. (10.2) centers, making them ideal for a variety of applications where quick assembly is needed and space is at a premium.
MECHANICAL DIMENSIONS
Notes: 1. Thermal compound is assumed between device and heat sink. 2. Tab temp with longer heat sink (634-20ABP) will typically be about 15% cooler. Tab temp with shorter heat sink (634- I0ABP) will typically be about 25% higher.
634 SERIES TYPICAL THERMAL PERFORMANCE FOR 634-15ABP
Dimensions: in. (mm)
637 SERIES
High-Efficiency Heat Sinks For Vertical Board Mounting
Height Above PC Board "A" in. (mm) Maximum Footprint in. (mm) 1.375 (34.9) x 0.500 (12.7) 1.375 (34.9) x 0.500 (12.7) 1.375 (34.9) x 0.500 (12.7) 1.375 (34.9) x 0.500 (12.7) Thermal Performance at Typical Load Natural Forced Convection Convection 76C @ 6W 65C @ 6w 55C @ 6W 48C @ 6W 5.8C/W @ 200 LFM 5.5C/W @ 200 LFM 4.7C/W @ 200 LFM 4.2C/W @ 200 LFM
TO-220
Standard P/N
Weight lbs. (grams) 0.023 (10.43) 0.035 (15.88) 0.050 (22.68) 0.062 (28.12)
637-10ABP 1.000 (25.4) 637-15ABP 1.500 (38.1) 637-20ABP 2.000 (50.8) 637-25ABP 2.500 (63.5) Material: Aluminum, Black Anodized
Wave-solderable pins on 1 in. centers for vertical mounting on printed circuit boards. Maximum semiconductor package width 0.625 in. (15.9). Use this heat sink where weight
and board space occupied must be minimized. Refer to the Accessory products section for thermal interface materials, thermal compounds, and other accessories products.
MECHANICAL DIMENSIONS
637 SERIES (EXTRUSION PROFILE 5183)
NATURAL AND FORCED CONVECTION CHARACTERISTICS
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
44
Normally stocked
Board Level Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
626 AND 627 SERIES
Standard P/N
High-Efficiency Heat Sinks for Vertical Board Mounting
Standard P/N Height Above PC Board "A" in. (mm) Maximum Footprint in. (mm) 1.375 (34.9) x .500 (12.7) 1.375 (34.9) x .500 (12.7) 1.375 (34.9) x .500 (12.7) 1.375 (34.9) x .500 (12.7)
TO-218, TO-220
Thermal Performance at Typical Load Natural Forced Convection Convection 76C @ 6W 65C @ 6W 55C @ 6W 48C @ 6W 5.8C/W @ 200 LFM 5.5C/W @ 200 LFM 4.7C/W @ 200 LFM 4.2C/M @ 200 LFM
626-10ABP 627-10ABP 1.000 (25.4) 626-15ABP 627-15ABP 1.500 (38.1) 626-20ABP 627-20ABP 2.000 (50.8) 626-25ABP 627-25ABP 2.500 (63-5) Wave-solderable pins. Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
626 AND 627 SERIES
NATURAL AND FORCED CONVECTION CHARACTERISTICS
Dimensions: in. (mm)
657 SERIES
Standard P/N
High-Performance Heat Sinks for Vertical Board Mounting
Height Above PC Board "A" in. (mm) Maximum Footprint in. (mm) Thermal Performance at Typical Load Natural Forced Convection Convection 41C @ 6W 38C @ 6W 32C @ 6W 25C @ 6W 3.7C/W @ 200 LFM 3.3C/W @ 200 LFM 2.9C/W @ 200 LFM 2.7C/W @ 200 LFM
TO-220, TO-247, TO-218
Weight lbs (grams) 0.0515 (23.36) 0.0760 (34.60) 0.1030 (47.00) 0.1250 (57.00)
657-10ABP 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 657-15ABP 1.500 (38.1) 1.650 (41.9) x 1.000 (25.4) 657-20ABP 2.000 (50.8) 1.650 (41.9) x 1.000 (25.4) 657-25ABP 2.500 (63.5) 1.650 (41.9) x 1.000 (25.4) Wave-solderable pins. Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
657 SERIES
NATURAL AND FORCED CONVECTION CHARACTERISTICS
657 SERIES (EXTRUSION PROFILE 6533)
Dimensions: in. (mm)
All other products, please contact factory for price, delivery, and minimums.
46
Normally stocked
Board Level Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
657 SERIES
Standard P/N
High-Performance Notched Heat Sinks for Vertical Board Mounting
Height Above PC Board "A" in. (mm) Maximum Footprint in. (mm)
TO-220, TO-247, TO-218
Thermal Performance at Typical Load Natural Forced Convection Convection 41C @ 6W 38C @ 6W 32C @ 6W 25C @ 6W 3.7C/W @ 200 LFM 3.3C/W @ 200 LFM 2.9C/W @ 200 LFM 2.7C/W @ 200 LFM
657-10ABPN 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 657-15ABPN 1.500 (38.1) 1.650 (41.9) x 1.000 (25.4) 657-20ABPN 2.000 (50.8) 1.650 (41.9) x 1.000 (25.4) 657-25ABPN 2.500 (63.5) 1.650 (41.9) x 1.000 (25.4) Wave-solderable pins. Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
657 SERIES
NATURAL AND FORCED CONVECTION CHARACTERISTICS
657 SERIES (EXTRUSION PROFILE 6533)
Dimensions: in. (mm)
657 SERIES
Standard P/N
High-Performance Heat Sinks with SpeedClipsTM for Vertical Board Mounting
Height Above PC Board "A" in. (mm) Maximum Footprint in. (mm)
TO-220, TO-247, TO-218
Thermal Performance at Typical Load Natural Forced Convection Convection 41C @ 6W 38C @ 6W 32C @ 6W 25C @ 6W 3.7C/W @ 200 LFM 3.3C/W @ 200 LFM 2.9C/W @ 200 LFM 2.7C/W @ 200 LFM
657-10ABPSC 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 657-15ABPSC 1.500 (38.1) 1.650 (41.9) x 1.000 (25.4) 657-20ABPSC 2.000 (50.8) 1.650 (41.9) x 1.000 (25.4) 657-25ABPSC 2.500 (63.5) 1.650 (41.9) x 1.000 (25.4) Wave-solderable pins. Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
657 SERIES
NATURAL AND FORCED CONVECTION CHARACTERISTICS
Dimensions: in. (mm)
657 SERIES (EXTRUSION PROFILE 6533)
677 SERIES
High-Performance, High-Power Heat Sinks for Vertical Board Mounting
Height Above PC Board "A" in. (mm) Maximum Footprint in. (mm)
TO-218, TO-220, TO-247 15-LEAD Multiwatt
Standard P/N
Thermal Performance at Typical Load Natural Forced Convection Convection 52C @ 6W 46C @ 6W 40C @ 6W 35C @ 6W 3.1C/W @ 200 LFM 2.8C/W @ 200 LFM 2.5C/W @ 200 LFM 2.2C/W @ 200 LFM
677-10ABP 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 677-15ABP 1.500 (38.1) 1.650 (41.9) x 1.000 (25.4) 677-20ABP 2.000 (50.8) 1.650 (41.9) x 1.000 (25.4) 677-25ABP 2.500 (63.5) 1.650 (41.9) x 1.000 (25.4) Wave-solderable pins. Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
677 SERIES
NATURAL AND FORCED CONVECTION CHARACTERISTICS
677 SERIES (EXTRUSION PROFILE 8719)
Dimensions: in. (mm)
Normally stocked
47
All other products, please contact factory for price, delivery, and minimums.
Board Level Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
690 SERIES
HIghest Efficiency/Lowest Unit Cost Heat Sinks
Height Above PC Board in. (mm) Outline Dimensions in. (mm) 1.860 (47.2)-sq 1.860 (47.2)-sq 1.860 (47.2)-sq Thermal Performance at Typical Load Natural Forced Convection Convection 44C @ 7.5W 44C @ 7.5W 44C @ 7.5W 2.0C/W @ 400 LFM 2.0C/W @ 400 LFM 2.0C/W @ 400 LFM Semiconductor Mounting Hole Pattern (1) TO-3 (1) TO-66 (2) TO-220
TO-3, TO-66, TO-220
Standard P/N
Weight lbs. (grams) 0.0700 (31.75) 0.0700 (31.75) 0.0700 (31.75)
690-3B 1.310 (33.3) 690-66B 1.310 (33.3) 690-220B 1.310 (33.3) Material: Aluminum, Black Anodized
These low-cost heat sinks provide the most power dissipation at the lowest unit cost and are available in three standard types to mount and cool one TO-3 or TO-66 metal power semiconductor type or two plastic package TO-220 power semiconductor types. For higher power
semiconductors, the 690 Series can dissipate up to 20 watts while maintaining a mounting surface temperature rise above ambient air temperature of no more than 91C.
MECHANICAL DIMENSIONS
SEMICONDUCTOR MOUNTING HOLES NATURAL AND FORCED CONVECTION CHARACTERISTICS
690 SERIES TO-3 TO-66 *TWO TO-220'S
Dimensions: in. (mm)
680 SERIES
Maximum Efficiency Omnidirectional Heat Sinks
Height Above PC Board "A" in. (mm) Horizontal Mounting Footprint Dimensions in. (mm) 1.810 (46.0)-sq 1.810 (46.0)-sq 1.810 (46.0)-sq 1.810 (46.0)-sq 1.810 (46.0)-sq 1.810 (46.0)-sq 1.810 (46.0)-sq 1.810 (46.0)-sq Thermal Performance at Typical Load Natural Forced Convection Convection 70C @ 7.5W 58C @ 7.5W 52C @ 7.5W 45C @ 7.5W 7OC @ 7.5W 58C @ 7.5W 52C @ 7.5W 45C @ 7.5W 3.0C/W @ 400 LFM 2.4C/W @ 400 LFM 2.0C/W @ 400 LFM 1.5C/W @ 400 LFM 3.0C/W @ 400 LFM 2.4C/W @ 400 LFM 2.0C/W @ 400 LFM 1.5C/W @ 400 LFM Semiconductor Mounting Hole Pattern (1) TO-3 (1) TO-3 (1) TO-3 (1) TO-3 (2) TO-220 (2) TO-220 (2) TO-220 (2) TO-220
TO-3, TO-220
Standard P/N
Weight lbs. (grams) 0.0700 (31.75) 0.0900 (40.82) 0.0980 (44.45) 0.1100 (49.90) 0.0700 (31.75) 0.0900 (40.82) 0.0980 (44.45) 0.1100 (49.90)
680-5A 0.500 (12.7) 680-75A 0.750 (19.1) 680-10A 1.000 (25.4) 680-125A 1.250 (31.8) 680-5220 0.500 (12.7) 680-75220 0.750 (19.1) 680-10220 1.000 (25.4) 680-125220 1.250 (31.8) Material: Aluminum, Black Anodized
Achieve optimum natural convection cooling per unit volume occupied above the printed circuit board for TO-3 (one semiconductor package per heat sink) or for two TO-220 style cases, when this low-cost heat sink is used. Any mounting attitude will provide free circulation
of air in natural convection applications. These 680 Series heat sinks can also be specified without any semiconductor mounting hole pattern by specifying suffix "K" (Example: 680-5K).
MECHANICAL DIMENSIONS
680 SERIES
NATURAL AND FORCED CONVECTION CHARACTERISTICS
SEMICONDUCTOR MOUNTING HOLES A 220 K
Dimensions: in. (mm)
TO-3 *TWO TO-220'S
All other products, please contact factory for price, delivery, and minimums.
48
Normally stocked
Board Level Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
601 AND 603 SERIES
Low-Height Heat Sinks
Footprint Dimensions in. (mm) Height in. (mm) 0.562 (14.3) 0.562 (14.3) 0.562 (14.3) 0.562 (14.3) Mounting Hole Dia. in. (mm) 0.200 (5.1) 0.270 (6.9) None None Thermal Performance at Typical Load Natural Forced Convection Convection 52C @ 5.0W 52C @ 5.0W 52C @ 5.0W 41C @ 5.0W 4.5C/W @ 175 LFM 4.5C/W @ 175 LFM 4.5C/W @ 175 LFM 4.0C/W @ 175 LFM
DO-4/DO-5 Diodes
Standard P/N
Weight lbs. (grams) 0.0500 (22.68) 0.0500 (22.68) 0.0500 (22.68) 0.0810 (36.74)
601E 2.000 (50.8) x 1.250 (31.8) 601F 2.000 (50.8) x 1.250 (31.8) 601K 2.000 (50.8) x 1.250 (31.8) 603K 2.000 (50.8) x 2.000 (50.8) Material: Aluminum Alloy, Black Anodized
Use these low-height heat sinks on printed circuit board applications for TO-66 power semiconductors and DO-4 and DO-5 diodes, where close board-to-board spacing and efficient
heat dissipation are required. The 601 and 603 Series may also be attached to enclosure panels or brackets using isolation hardware where necessary.
MECHANICAL DIMENSIONS
NATURAL AND FORCED CONVECTION CHARACTERISTICS
601 SERIES (EXTRUSION PROFILE 1284)
603 SERIES (EXTRUSION PROFILE 1284) SEMICONDUCTOR MOUNTING HOLES K E F
Dimensions: in. (mm)
635 SERIES
Space-Saving Low-Cost Heat Sinks
Height Above PC Board "A" in. (mm) Outline Dimensions in. (mm) Thermal Performance at Typical Load Natural Forced Convection Convection 90C @ 8.0W 77C @ 8.0W 61C @ 8.0W 53C @ 8.0W 6.0C/W @ 300 LFM 4.8C/W @ 300 LFM 3.6C/W @ 300 LFM 3.1C/W @ 300 LFM Semiconductor Mounting Hole Pattern TO-3 TO-3 TO-3 T0-3
TO-3
Standard P/N
Weight lbs. (grams) 0.0200 (9.07) 0.0220 (9.98) 0.024 (10.89) 0.028 (12.70)
635-5B2 0.500 (12.7) 1.900 (48.3) x 1.420 (36.0) 635-75B2 0.750 (19.1) 1.900 (48.3) x 1.420 (36.0) 635-10B2 1.000 (25.4) 1.900 (48.3) x 1.420 (36.0) 635-125B2 1.250 (31.8) 1.900 (48.3) x 1.420 (36.0) Material: Aluminum Alloy, Black Anodized
Use this low-cost TO-3 heat sink style for multiple TO-3 applications on a single printed circuit board, where two or more TO-3s must be placed in proximity and minimum space is
available for heat sinking. Four different heights are available, all with TO-3 mounting hole pattern in the base. Consult factory for TO-66, TO-220, and multilead IC hole patterns. NATURAL AND FORCED CONVECTION CHARACTERISTICS
MECHANICAL DIMENSIONS
635 SERIES
Dimensions: in. (mm)
Normally stocked
49
All other products, please contact factory for price, delivery, and minimums.

▲Up To Search▲

Price & Availability of 290-1AB

	To Download 290-1AB Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .